We operate a £6m state-of-the-art class 100 Cleanroom offering photo-electron and focused ion-beam lithography and has an extensive microwave and high-frequency electronics infrastructure which supports a number of programmes in the school and across the university.
Concerned with the manipulation and arrangement of components on the nanometrenanometer scale, the transformative possibilities of in this field are immense for the physical, biological and medical sciences and their allied industrial and clinical applications. As such, Nanotechnology is identified by research funding bodies around the globe as a priority area.
Our semiconductor nanotechnology cleanroom was has undergone several major investments during the past decade. Our latest £4.5m electron beam lithography system allows us to fabricate structures to a resolution below 10nm. It offers a highly reproducible stitching and overlay accuracy of under 20nm, and an ability to pattern a complete six-inch wafer. We also provide offer optical and ion beam lithography.
With a dedicated technician and experimental office to support us, we participates in cross-disciplinary research projects within the University of Leeds and beyond. We are involved in projects looking at nano-spintronic devices, nanomagnetism, magnetic nanowires, high-frequency nanoelectronics, single- molecule electronics and hybrid bio-electronic materials.
Specialist services include: ALD, PECVD, sputtering, evaporation; ICP-RIE, IBE, wet etching; FEG-SEM, AFM, surface profilometry; EBL, RTA, post-processing.
We are committed to sharing our facilities and associated expertise with external academic and industrial collaborators. To make an enquiry please email Professor Edmund Linfield or Professor John Cunningham
- Surface profiler is a tool that provides 2D high accurate measurement on semiconductor substrate by scanning a sharp diamond tipped stylus with 5 microns in radius across substrate surface.
- Wafer saw cut semiconductor wafer into small die using mechanical dicing saw. The Loadpoint MicroAce 66 wafer saw is a 150mm capable dicing saw with Off-chuck contact height sensing, which allow use of conductive and non-conductive blades.
- Digital Instruments Dimension 3100
- The Thermal evaporator uses thermal heat to heat up a solid target source in a boat such as tungsten boat to its melting temperature, causing atoms to evaporate from the target to coat substrate in the vacuum chamber
- The JBX-6300FS is a state-of-the-art vector scan electron beam lithography system capable of patterning lines less than 10 nm wide.
- Lapping machine is used for glass grinding. It grinds microscope slides and thin sections.
- KARL SUSS MJB3 mask aligner for UV lithography, a microfabrication process to selectively remove parts of a thin film of photoresist on a substrate.
- EV610 mask aligner
- Advanced Vacuum Systems AB APEX SLR ICP RIE etching system
- RIEPECBD: Reactive ion etching (RIE) is an etching technique that uses chemically reactive plasma to remove material on substrate such as semiconductor wafers.
- Wafer scriber cuts semiconductor wafers into small pieces with a diamond scriber. The Karl Suss wafer scriber has a 3” wafer chuck and x-y movement with resolution of 10 microns step.
- JFP Microtechnic S100 Scriber
- Kurt Lesker PVD 75 Sputter system: sputter deposition is a physical vapor deposition method to deposite thin films onto a substrate by sputtering material from a target source.
- Thermal Metal Evaporator: uses thermal heating to heat up a solid target source in a boat such as tungsten boat to its melting temperature, causing atoms evaporated from the target to coat substrate in the vacuum chamber.
- Turnkey Electron beam lithography system uses a focused fine electron beam to scan a pattern specifically designed across a substrate surface covered with a film of resist.
- OERLIKON LEYBOLD VACUUM Univex 350 Vacuum experimentation system provides physical vapour deposition
- APPLIED MICRO ENGINEERING AML-AWB-04 Wafer Bonding System
- The wedge bonder can make interconnections between a semiconductor device and a bonding chip package using heat, pressure and ultrasonic energy.